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WebJun 1, 1998 · In power electronic packages wire bonding is used for the electrical interconnection from the chips to the output pins. Wire bond litt-offand solder fatigue are limiting the reliability. In this work we investigate the initiation and growth of cracks in the wire bonds using finite-element analysis. 1998 Elsevier Science Ltd. All rights reserved. 1. WebNochar polymers create a very strong mechanical bond as well as immobilizing waste on a molecular level. Once bonded, the new solid waste form is far safer and more stable for … WebSep 1, 2009 · Factors governing heat affected zone during wire bonding. In the wire bonding process of microelectronic packaging, heat affect zone (HAZ) is an important … miller\u0027s paving hawaii